Intelligent Integrated Systems: Devices, Technologies, and ...
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21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. K. Yamasaki, Y. Itoh, A. Wada, K. Morimoto, Y. Tomita. 4-Layer 3D IC Technologies for Parallel Signal Processing. Digest Int Elec Dev Meeting. 1990:599. Y. Uemoto, R. Fujii, A. Nakamura, K. Senda.